The Nippon Building, Renesas Electronics' world headquarters in Chiyoda-ku, Tokyo
|Traded as||TYO: 6723|
|Predecessor||NEC Electronics Corporation, Renesas Technology Corporation|
November 1, 2002|
(Started operation on April 1, 2010)
|Headquarters||Tokyo (registered head office: Kawasaki), Japan|
Hisao Sakuta (Representative Director, Chairman and CEO) |
Tetsuya Tsurumaru (Representative Director, President and COO)
|Products||Microcontrollers, Power MOSFETs, mixed-signal ICs, IGBT, Diodes, small signal transistors, display driver ICs, compound semiconductors, ASIC, ASSP|
Number of employees
Renesas Electronics Corporation (ルネサス エレクトロニクス株式会社 Runesasu Erekutoronikusu Kabushiki Gaisha) TYO: 6723 is a Japanese semiconductor manufacturer headquartered in Tokyo. It has manufacturing, design and sales operations in around 20 countries. It is the world's largest auto semiconductor maker in 2014, one of the world's largest makers of semiconductor systems for mobile phones, the world's largest maker of microcontrollers, and the second largest maker of application processors. It also makes LCD drivers, RF ICs, mixed-signal integrated circuits and system on a chip semiconductors.
Renesas Electronics started operation in April 2010, through the integration of NEC Electronics Corporation and Renesas Technology Corporation. NEC Electronics was established in November 2002 by a spin-off of the semiconductor operations of NEC. Renesas Technology was established on April 1, 2003, as a joint venture of Hitachi, Ltd. (55%) and Mitsubishi Electric (45%).
In April 2009, Renesas Technology and NEC Electronics reached a basic agreement to merge by around April 2010. On April 1, 2010 NEC Electronics and Renesas Technology merged, forming Renesas Electronics which became the fourth largest semiconductor company according to iSuppli published data.
In December 2010 Renesas Mobile Corporation (RMC) was created by integrating the Mobile Multimedia Business Unit of Renesas with the acquired Nokia Wireless Modem Business Unit.
In 2011, Renesas Electronics was adversely affected by the 2011 Tōhoku earthquake and tsunami and flooding in Thailand. In 2012, the company decided to restructure its business, including the sale and consolidation of its Japanese domestic plants, to get profitable. In December 2012, INCJ, Japan’s government-backed fund, and several key clients decided to invest in the company. Through the investment, Renesas aimed to secure 150 billion yen as fresh capital by September 2013 and use it for realizing the Smart Society through investment in the microcontroller and Analog & Power semiconductor development, plant improvements, automotive and industrial semiconductor solutions and corporate acquisitions.
In September 2013, Broadcom acquired most of Renesas Mobile Communication.
In December 2014, Renesas Electronics introduced 5 new product versions in the RMLV0816B and RMLV0808B series of Advanced Low-Power SRAM (Advanced LP SRAM), the company’s flagship static random-access memory (SRAM) devices.
Renesas Electronics' products include:
- System LSIs
- Discrete devices (diodes, Power MOSFETs, thyristors and triacs, transistors)
- Memory ICs (Flash, SRAM)
- System on a chip R-Car
|Innovation Network Corporation of Japan||69.15%|
|Japan Trustee Services Bank, Ltd.||8.11%|
|Hitachi, Ltd. (TYO: 6501)||7.66%|
|Mitsubishi Electric Corporation (TYO: 6503)||6.26%|
|Toyota Motor Corporation (TYO: 7203)||2.49%|
|Nissan Motor Co., Ltd (TYO: 7201)||1.49%|
At the end of September 2013, Renesas issued new shares through third-party allotment resulting in Innovation Network Corporation of Japan becoming the new largest shareholder and non-parental controlling shareholder.
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- "Company profile". Renesas Electronics Corporation. March 2016. Retrieved 02 Nov 2016. Check date values in:
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- Ricker, Thomas. "Nokia sells wireless modem business to Renesas in bid to refocus". Engadget. Retrieved 11 December 2015.
- “Quake-hit Renesas plant restarts production” June 5, 2011 The Daily Yomiuri
- “Japan's Renesas seeks to cut 12 pct of workforce” July 3, 2012 Reuters.
- “Renesas aims to complete restructuring in 3 years” July 3, 2012 Reuters.
- "Broadcom aqcuires Renesas Mobile Europe". Helsinki Business Hub. 5 September 2013. Retrieved 5 February 2015.
- Virtual-Strategy Magazine. “Renesas Electronics Introduces High-Reliability Advanced Low-Power SRAM Products.” December 11, 2014. December 11, 2014.
- "Distributions of Shareholders and Shares". Renesas Electronics Corporation. 30 September 2013. Retrieved 23 November 2013.
- "Renesas Electronics Announces Partial Correction and Update on "Renesas Electronics Announces Share Issue through Third-Party Allotment, and Change in Major Shareholders, Largest Shareholder who is a Major Shareholder, Parent Company and Other Related Companies"". Renesas Electronics Corporation. September 30, 2013.
- Mari Saito and Ayai Tomisawa (May 22, 2012). "Japan's Renesas to cut 6,000 jobs, raise capital". Reuters.
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