HiSilicon
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Native name | 海思半导体有限公司 |
|---|---|
| Subsidiary | |
| Traded as | HiSilicon |
| Industry | Fabless semiconductors, Semiconductors, Integrated circuit design |
| Founded | 2004 |
| Headquarters | Shenzhen, Guangdong, China |
| Products | SoCs |
| Parent | Huawei |
| Website |
www |
| HiSilicon | |||||||
| Simplified Chinese | 海思半导体有限公司 | ||||||
|---|---|---|---|---|---|---|---|
| Traditional Chinese | 海思半導體有限公司 | ||||||
| Literal meaning | Haisi Semiconductor Limited Company | ||||||
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HiSilicon (Chinese: 海思; pinyin: Hǎisī) is a Chinese fabless semiconductor company based in Shenzhen, Guangdong and fully owned by Huawei.
HiSilicon purchased licenses from ARM Holdings for at least ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,[1][2] ARM Cortex-A53, and ARM Cortex-A57 and also for the Mali-T628 MP4.[3][4]
HiSilicon also purchased licenses from Vivante Corporation for their GC4000 graphics core.
HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.[5]
Products
K3V1
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (MHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| K3V1 (Hi3611) | 130 nm | ARMv5 | ARM9E | 1 | 800 | 2009 | List
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K3V2
The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones[6] and Huawei MediaPad 10 FHD7 tablets.[7] This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU.[8] The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| K3V2 (Hi3620) | 40 nm | ARMv7 | Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB | 4 | 1.5 | Vivante GC4000 | 480 MHz, 30.7 GFLOPS | LPDDR2 | 64-bit dual-channel | 7.2 (up to 8.5) | N/A | N/A | N/A | N/A | 2012 | List
|
K3V2E
This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| K3V2E | 28 nm | ARMv7 | Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB | 4 | 1.5 | Vivante GC4000 | 480 MHz, 30.7 GFLOPS | LPDDR2 | 64-bit dual-channel | 7.2 (up to 8.5) | N/A | N/A | N/A | N/A | 2013 | List
|
Kirin 620
• supports - USB 2.0 / 13 MP / 1080p video encode
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| Kirin 620 | 28 nm | ARMv8-A | Cortex-A53 | 8 | 1.2 GHz (A53) | Mali-450 MP4 | 700 MHz(41.8GFlops) | LPDDR3 ( MHz) | 64-bit dual-channel | 12.8 | N/A | Dual SIM LTE Cat.4 (150Mbit/s) | 802.11 b/g/n (Wifi Direct & Hotspot) Not Supporting DLNA / Miracast | Bluetooth v4.0, A2DP, EDR, LE | Q1 2015 | List
|
Kirin 650
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| Kirin 650 | 16 nm FinFET+ | ARMv8-A | Cortex-A53 Cortex-A53 |
8 | 2.0 (4xA53) 1.7 (4xA53) | Mali-T830 MP2 | 900MHz(40.8GFlops) | LPDDR3 (933MHz) | 64-bit dual-channel | N/A | Dual SIM LTE Cat.6 (300Mbit/s) | N/A | N/A | Q2 2016 | List
| |
| Kirin 655 | 16 nm FinFET+ | ARMv8-A | Cortex-A53 Cortex-A53 |
8 | 2.1 (4xA53) 1.7 (4xA53) | Mali-T830 MP2 | 900MHz(40.8GFlops) | LPDDR3 (933MHz) | 64-bit dual-channel | N/A | Dual SIM LTE Cat.6 (300Mbit/s) | N/A | N/A | Q4 2016 | List
| |
Kirin 910
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| Kirin 910 | 28 nm HPM | ARMv7 | Cortex-A9 | 4 | 1.6 | ARM Mali-450 MP4 | 533 MHz(35.8GFlops) | LPDDR3 | 32-bit single-channel | 6.4 | N/A | LTE Cat.4 | N/A | N/A | H1 2014 | |
| Kirin 910T | 1.8 | 700 MHz(41.8GFlops) | LPDDR3 | 32-bit single-channel | 6.4 | N/A | LTE Cat.4 | N/A | N/A | H1 2014 | List
| |||||
Kirin 920
• The Kirin 920 SoC also contains an image processor that supports up to 32 megapixel
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| Kirin 920 | 28 nm HPM | ARMv7 | Cortex-A15 Cortex-A7 big.LITTLE | 4+4 | 1.7 GHz (A15) 1.3 GHz (A7) |
Mali-T624 MP4 | 600 MHz(76.8GFlops) | LPDDR3 (1600 MHz) | 32-bit dual-channel | 12.8 | N/A | LTE Cat.6 (300Mbit/s) | N/A | N/A | H2 2014 | List
|
| Kirin 925 | 28 nm HPM | ARMv7 | Cortex-A15 Cortex-A7 big.LITTLE |
4+4 | 1.8 GHz (A15) 1.3 GHz (A7) |
Mali-T628 MP4 | 600MHz(76.8GFlops) | LPDDR3 (1600 MHz) | 32-bit dual-channel | 12.8 | N/A | LTE Cat.6 (300Mbit/s) | N/A | N/A | Q3 2014 | List
|
Kirin 930
• supports - SD 3.0 (UHS-I) / eMMC 4.51 / Dual-band a/b/g/n Wi-Fi / Bluetooth 4.0 Low Energy / USB 2.0 / 32 MP ISP / 1080p video encode
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| Kirin 930 | 28 nm HPC | ARMv8-A | Cortex-A53 Cortex-A53 |
4+4 | 2.0 GHz (4 x A53) 1.5 GHz (4 x A53) |
Mali-T628 MP4 | 600MHz(76.8GFlops) | LPDDR3 (1600 MHz) | 64-bit(2x32-bit) Dual-channel | 12.8 GB/s | N/A | Dual SIM LTE Cat.6 (DL:300Mbit/s UP:50Mbit/s) | N/A | N/A | Q1 2015 | List
|
| Kirin 935 | 28 nm HPC | ARMv8-A | Cortex-A53 Cortex-A53 |
4+4 | 2.2 GHz (4 x A53) 1.5 GHz (4 x A53) |
Mali-T628 MP4 | 680MHz(87GFlops) | LPDDR3 (1600 MHz) | 64-bit(2x32-bit) Dual-channel | 12.8 GB/s | N/A | Dual SIM LTE Cat.6 (DL:300Mbit/s UP:50Mbit/s) | N/A | N/A | Q1 2015 | List
|
Kirin 950
• supports - SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Native 10-bit 4K video encode / i5 coprocessor / Tensilica HiFi 4 DSP
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| Kirin 950 | 16 nm FinFET Plus[13] | ARMv8-A | Cortex-A72 Cortex-A53 big.LITTLE |
4+4 | 2.3 GHz (4 x A72) 1.8 GHz (4 x A53) |
Mali-T880 MP4 | 900MHz(122.4GFlops) | LPDDR4 | 64-bit(2x32-bit) Dual-channel | 25.6 GB/s | N/A | Dual SIM LTE Cat.6 | N/A | N/A | Q4 2015 | Huawei Mate 8, Huawei Honor V8, Huawei Honor 8 |
| Kirin 955[14] | 16 nm FinFET Plus | ARMv8-A | Cortex-A72 Cortex-A53 big.LITTLE |
4+4 | 2.5 GHz (4 x A72) 1.8 GHz (4 x A53) |
Mali-T880 MP4 | 900MHz(122.4GFlops) | LPDDR3(3 GB) LPDDR4 (4 GB) | 64-bit(2x32-bit) Dual-channel | 25.6 GB/s | N/A | Dual SIM LTE Cat.6 | N/A | N/A | Q2 2016 | Huawei P9, Huawei P9 Plus, Honor Note 8, Honor V8 |
Kirin 960
- Interconnect: ARM CCI-550, Storage: UFS 2.1
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| Kirin 960[15] | 16 nm FinFET Plus | ARMv8-A | Cortex-A73 Cortex-A53 big.LITTLE |
4+4 | 2.4 GHz (4 x A73) 1.8 GHz (4 x A53) |
Mali-G71 MP8 | 900MHz | LPDDR4-1800 | 64-bit(2x32-bit) Dual-channel | N/A | Dual SIM LTE Cat.12 LTE 4x CA, 4x4 MIMO | N/A | N/A | Q4 2016 | Huawei Mate 9, Huawei Mate 9 Porsche Design, Huawei Mate 9 Pro | |
Similar platforms
- R-Car by Renesas
- Tegra by Nvidia
- OMAP by Texas Instruments
- Exynos by Samsung
- Snapdragon by Qualcomm
- Ax by Apple
- Atom by Intel
- i.MX by Freescale Semiconductor
- RK3xxx by Rockchip
- Allwinner Axy by AllWinner
- MTxxxx by MediaTek
References
- ↑ HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications, 02 August 2011 on ARM.com
- ↑ "HiSilicon Technologies Co., Ltd. 海思半导体有限公司". ARM Holdings. Retrieved 26 April 2013.
- ↑ ARM Launches Cortex-A50 Series, the World’s Most Energy-Efficient 64-bit Processors on ARM.com
- ↑ Lai, Richard. "Huawei's HiSilicon K3V3 chipset due 2H 2013, to be based on Cortex-A15". Engadget. Retrieved 26 April 2013.
- ↑ "Hisilicon grown into the largest local IC design companies". Windosi. September 2012. Retrieved 26 April 2013.
- ↑ brightsideofnews.com: Huawei U9510 Ascend D Quad XL Benchmarked on ARMdevices.net
- ↑ Huawei introduces quad-core 10 inch tablet with 1080p display on Liliputing.com
- ↑ Hands On with the Huawei Ascend W1, Ascend D2, and Ascend Mate on Anandtech
- ↑ "Huawei MediaPad X1". DeviceSpecifications. Retrieved 14 March 2014.
- ↑ "Huawei P6 S". Huawei. Retrieved 12 June 2014.
- ↑ "Huawei MediaPad M1". DeviceSpecifications. Retrieved 14 March 2014.
- ↑ "Huawei Honor 6". DeviceSpecifications. Retrieved 25 June 2014.
- ↑ Huawei Ascend Mate 8/Honor 7’s Kirin 940/950 Processor Performance & Specs
- ↑ Kirin 955, Huawei P9, P9 Plus
- ↑ "Huawei announces the HiSilicon Kirin 960: 4xA73 + 4xA53, G71MP8, CDMA". AnandTech. 2016-10-19.
External links
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